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| High-speed Buffer Amplifier for CCD Image Sensor CXA3741AUR Description The CXA3741UR is a high-speed buffer amplifier IC with built-in switches. (Applications: CCD image sensor output buffers, digital still cameras, camcorders, other general buffers) Features Power consumption: 26 mW (typ.) (IDRV = 50A (220k when VCC = 15V), ISF current = 0, during no signal) Push-pull output High-speed response: 500 V/s (IDRV = 50A (220k when VCC = 15V), CL = 20pF) Internal sink current mode for CCD source follower output. Settable by external resistance RISF Sink current and drive current with each built-in switch. Each current value can be set by an external resistance. Structure Bipolar silicon monolithic IC Absolute Maximum Ratings (Ta = 25C) Supply voltage Input voltage Storage temperature Allowable power dissipation VCC IN Tstg PD 16 GND - 0.3 to VCC + 0.3 -65 to +150 0.73 V V C W (when mounted on a two-layer board; 30mm x 30mm, t = 0.8mm) Recommended Operating Conditions Supply voltage Operating temperature VCC Ta 9 to 15.5 -20 to +75 V C Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E07711 CXA3741AUR Block Diagram and Pin Description SFCNT 1 IDRV1 4 3 IDRV0 2 GND VCC 5 16 DRVCNT ISF0 6 15 GND ISF1 7 14 OUT NC 8 13 NC 9 10 11 12 GND IN GND -2- NC CXA3741AUR Pin Description and I/O Pin Equivalent Circuit Standard voltage level 0V 15V 0V 0V 0V Pin No. 4 5 9 11 15 Symbol GND VCC GND GND GND I/O -- -- -- -- -- Equivalent circuit -- -- -- -- -- GND Description Power supply GND GND GND Switches the sink current setting for CCD with open source output. When the SFCNT pin (Pin 16) input logic is low, the sink current is set according to the current set by the ISF0 pin (Pin 6). When high, the sink current is set according to the current set by the ISF1 pin (Pin 7). Switches the drive current setting. When the DRVCNT pin (Pin 16) input logic is low, the drive current is set according to the current set by the IDRV0 pin (Pin 2). When high, the drive current is set according to the current set by the IDRV1 pin (Pin 3). External resistor connection for setting the drive current. Connect external resistors between these pins and VCC (Pin 5). When not using this function, connect these pins to GND. *The minimum value for external resistors should be 100k (when VCC is 15V). 1 SFCNT I CMOS VCC 10A 10A 2k 1 16 2k 60k 60k 16 DRVCNT I CMOS GND VCC 2 IDRV0 I -- 30k 2 3 30k 3 IDRV1 I -- GND 20k 20k -3- CXA3741AUR Pin No. Symbol I/O Standard voltage level VCC Equivalent circuit Description External resistor connection for setting the CCD with open source output sink current. Connect external resistors between these pins and VCC (Pin 5). When not using this function, connect these pins to GND. *The minimum value for external resistors should be 100k (when VCC is 15V). 6 ISF0 I -- 30k 6 7 30k 7 ISF1 I -- GND 20k 20k VCC 1.5k 10 x IDRV 10 IN I CCD output voltage 10 Input 10A GND 58 x IISF 10 x IDRV 2k VCC 50 14 OUT O IN 14 Output 50 GND -4- CXA3741AUR Electrical Characteristics (Ta = 25C, VCC = 15V, RIDRV0 = 220k, RIDRV1 = 470k, ISF0 and ISF1 pins: connected to GND) Item Symbol Measurement conditions IN = 10V, RDRV0 = 220k, RDRV1 = 470k DRVCNT = 0V *1 Min. Typ. Max. Unit Supply current ICC 1.5 1.7 1.9 mA Voltage gain I/O offset voltage VGAIN VOFFSET IN: F10Vdc V = 1V GAIN = OUT/V IN = 10V VOFFSET = OUT-IN RIDRV = 100k RIDRV = 150k RIDRV = 220k RIDRV = 330k IN = 10V, ISF0, 1 = 0V, IDRV0, 1 = 220k IN = 10V, ISF0, 1, IDRV0, 1 = 0V -- -100 3.3 2.9 2.5 2.1 -6.0 3.0 0.999 -- -- -- -- -- 3.0 9.0 -- 100 VCC - 2.0 VCC - 1.85 VCC - 1.8 VCC - 1.7 20 15 V/V mV I/O voltage range VRANGE V A A Input bias current IBIAS Sink current Switch control voltage "High" Switch control voltage "Low" *1 ISINK IN = 10V, RISF0 = 220k, RISF1 = 470k SFCNT = 0V 2.6 2.9 3.2 mA VcontH VDD = 3.0 0.3V VcontL 2.025 -- -- -- -- 0.825 V V Voltage gain 10.5V IN V = 1V 9.5V OUT OUT -5- CXA3741AUR AC Characteristics (Ta = 25C, IDRV = 50A (220k when VCC = 15V), ISF0 and ISF1 pins: connected to GND, RL = 15, CL = 20pF) Item Bandwidth Rise time Symbol GBW TRISE Measurement conditions IN = 50mVp-p *1 Min. -- -- Typ. 220 2.5 Max. -- 3.5 Unit MHz ns IN = 9.5 to 10.5V 10 to 90% *1 Fall time TFALL IN = 10.5 to 9.5V 10 to 90% *1 -- 3.0 4.0 ns I/O delay time TDELAY IN = 9.5 to 10.5V @50% 0.9 1.0 2.0 ns *1 Rise time, fall time and I/O delay time 10.5V IN 50% 9.5V 90% OUT 10% 10% 90% 50% TFALL TRISE TDELAY -6- CXA3741AUR Evaluation Circuit 470k IDRV1 GND 220k SFCNT IDRV0 4 1000pF VCC 5 3 2 1 16 DRVCNT ISF0 220k 6 Current Mirror Current Mirror 15 GND ISF1 470k 7 14 OUT 15 20pF NC 8 13 NC 9 GND 10 IN 11 GND 12 NC 15.0V GND 47F -7- CXA3741AUR Description of Operation Current Settings 1. Output Drive Current The small signal output impedance of the OUT pin (Pin 14) can be set by connecting the IDRV0 pin (Pin 2) or the IDRV1 pin (Pin 3) to VCC through a resistor. The inflow current to the IDRV pin is multiplied by 10 times inside the IC, and flows as the output stage idling current. The IDRV pins have internal 50k resistors. When the drive current setting switching pin DRVCNT (Pin 16) input logic is low, the inflow current to the IDRV pin is set according to the current set by the IDRV0 pin (Pin 2). When high, the inflow current to the IDRV pin is set according to the current set by the IDRV1 pin (Pin 3). The above-mentioned inflow current to the IDRV pin can be calculated as follows. IIDRV = (VCC - VBE x 2)/(RIDRV + 50k) = (15 - 1.46)/270k = 50.1A Here, VCC = 15V, VBE = 0.73V (typ.), and RIDRV = 220k. The small signal output impedance at this time can be calculated as follows. ROUT = (26mV/(10 x IIDRV))/2 = (26mV/501A)/2 = 26 2. Sink Current for CCD with Open Source Output The sink current of the IN pin (Pin 10) can be set by connecting the ISF0 pin (Pin 6) or the ISF1 pin (Pin 7) to VCC through a resistor. This sink current can be used as the CCD output stage source follower drive current. The inflow current to the ISF pin is multiplied by 58 times inside the IC, and flows as the sink current. The ISF pins have internal 50k resistors. When the CCD source follower output sink current setting switching pin SFCNT (Pin 1) input logic is low, the inflow current to the ISF pin is set according to the current set by the ISF0 pin (Pin 6). When high, the inflow current to the ISF pin is set according to the current set by the ISF1 pin (Pin 7). The above-mentioned inflow current to the ISF pin can be calculated as follows. IISF = (VCC - VBE x 2)/(RISF + 50k) = (15 - 1.46)/270k = 50.1A Here, VCC = 15V, VBE = 0.73V (typ.), and RISF = 220k. The sink current at this time can be calculated as follows. Isink = 58 x IISF = 2.9mA Note) This IC operation depends on IDRV and ISF. This specification is described based on IDRV of 220k when VCC = 15V. However , set it to 180k to occur the same current when using under the condition that VCC = 13V. [IDRV and ISF vs external resistor] Current (A) When VCC = 15V When VCC = 13V 90 100 78 68 150 120 50 220 180 35 330 270 26 470 390 Unit k k -8- CXA3741AUR Example of Representative Characteristics (Upper side) I/O voltage range vs. IDRV pin setting resistance VCC - 0 Ta = 25C 0.5 1.0 3.5 I/O voltage [V] 1.5 2.0 2.5 3.0 1.0 3.5 4.0 0 50 100 150 200 250 300 350 IDRV pin setting resistance [k] 0.5 0 0 I/O voltage [V] VCC = 13V VCC = 15V 3.0 2.5 2.0 1.5 5.0 (Lower side) I/O voltage range vs. IDRV pin setting resistance Ta = 25C 4.5 4.0 VCC = 15V VCC = 13V 50 100 150 200 250 300 350 IDRV pin setting resistance [k] Current consumption vs. IDRV pin setting resistance 4.0 Ta = 25C, VIN = VCC - 5V 3.5 Current consumption [mA] 3.0 2.5 2.0 VCC = 13V 1.5 1.0 VCC = 15V Sink current [mA] Sink current vs. ISF pin setting resistance 5.0 Ta = 25C, RIDRV = 220k, VIN = VCC - 5V 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 VCC = 15V VCC = 13V 0.5 0 0 50 100 150 200 250 300 350 IDRV pin setting resistance [k] 0.5 0 0 50 100 150 200 250 300 350 ISF pin setting resistance [k] Current consumption vs. Supply voltage 2.2 2.0 Current consumption [mA] 1.8 1.6 1.4 1.2 1.0 0.8 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 Supply voltage [V] Ta = 25C, RISF0, 1 = GND, RIDRV0 = 220k, RIDRV1 = GND, VIN = VCC - 5V Current consumption vs. Operating temperature 2.2 2.0 Current consumption [mA] 1.8 1.6 1.4 1.2 1.0 0.8 -50 VCC = 15V, RISF0, 1 = GND, RIDRV0 = 220k, RIDRV1 = GND, VIN = VCC - 5V -25 0 25 50 75 100 Operating temperature [C] -9- CXA3741AUR I/O offset voltage vs. Supply voltage 20.0 Ta = 25C, RISF0, 1 = GND, RIDRV0 = 220k, RIDRV1 = GND, VIN = VCC - 5V I/O offset voltage [mV] 10.0 I/O offset voltage [mV] I/O offset voltage vs. Operating temperature 20.0 VCC = 15V, RISF0, 1 = GND, RIDRV0 = 220k, RIDRV1 = GND, VIN = VCC - 5V 10.0 0.0 0.0 -10.0 -10.0 -20.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 Supply voltage [V] -20.0 -50 -25 0 25 50 75 100 Operating temperature [C] Input bias current vs. Supply voltage 5.0 4.0 3.0 Input bias current [A] 2.0 1.0 0.0 -1.0 -2.0 -3.0 -4.0 -5.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 Supply voltage [V] Ta = 25C, RISF0, 1 = GND, RIDRV0 = 220k, RIDRV1 = GND, VIN = VCC - 5V Input bias current vs. Operating temperature 5.0 4.0 3.0 Input bias current [A] 2.0 1.0 0.0 -1.0 -2.0 -3.0 -4.0 -5.0 -50 -25 0 25 50 75 100 VCC = 15V, RISF0, 1 = GND, RIDRV0 = 220k, RIDRV1 = GND, VIN = VCC - 5V Operating temperature [C] Sink current vs. Supply voltage 3.5 Ta = 25C, RISF0, 1 = GND, RIDRV0 = 220k, RIDRV1 = GND, VIN = VCC - 5V 3.0 Sink current [mA] Sink current [mA] 3.4 Sink current vs. Operating temperature VCC = 15V, RISF0, 1 = GND, RIDRV0 = 220k, RIDRV1 = GND, VIN = VCC - 5V 3.2 3 2.5 2.8 2.0 2.6 1.5 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 Supply voltage [V] 2.4 -50 -25 0 25 50 75 100 Operating temperature [C] - 10 - CXA3741AUR Tr and Tf vs. Supply voltage 6.0 5.0 4.0 Tf 3.0 2.0 1.0 0 10.0 Tr Ta = 25C, RIDRV = 220k, CL = 20pF, RL = 15, Input DC offset = VCC - 5V, Input amplitude = 1.0V, Input rise, fall time = 2.0ns 11.0 12.0 13.0 14.0 15.0 16.0 4.0 3.5 3.0 Tr and Tf [ns] Tr and Tf [ns] 2.5 2.0 1.5 1.0 0.5 Tr and Tf vs. Operating temperature Tf Tr VCC = 15V, RIDRV = 220k, CL = 20pF, RL = 15, Input DC offset = VCC - 5V, Input amplitude = 1.0V, Input rise, fall time = 2.0ns -25 0 25 50 75 100 0 -50 Supply voltage [V] Operating temperature [C] I/O delay time vs. Supply voltage 2.00 1.75 1.50 I/O delay time [ns] I/O delay time [ns] 1.25 1.00 0.75 0.50 0.25 0 10.0 Ta = 25C, RIDRV = 220k, CL = 20pF, RL = 15, Input DC offset = VCC - 5V, Input amplitude = 1.0V, Input rise, fall time = 2.0ns 11.0 12.0 13.0 14.0 15.0 16.0 I/O delay time vs. Operating temperature 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0 -50 VCC = 15V, RIDRV = 220k, CL = 20pF, RL = 15, Input DC offset = VCC - 5V, Input amplitude = 1.0V, Input rise, fall time = 2.0ns -25 0 25 50 75 100 Supply voltage [V] Operating temperature [C] Positive pulse response 0.2V/div 0.2V/div Negative pulse response VCC = 15V, RIDRV = 220k, CL = 20pF, RL = 15 Input rise, fall time = 2.0ns T Output Input T 10.0V T Output 10.0V T Input VCC = 15V, RIDRV = 220k, CL = 20pF, RL = 15 Input rise, fall time = 2.0ns Ch1 200mV Ch2 200mV M 1.00ns Ch1 10.0V 1.0ns/div Ch1 200mV Ch2 200mV M 1.00ns Ch1 10.0V 1.0ns/div - 11 - CXA3741AUR Application Circuit 1 (when using CCD with open source output) 470k IDRV1 GND 220k SFCNT IDRV0 1000pF 0.1F VCC 5 4 3 2 1 16 DRVCNT ISF0 220k 6 Current Mirror Current Mirror 15 GND ISF1 470k 7 14 OUT CDS/ADC NC 8 13 NC 15V GND 9 10 IN 11 GND 12 NC GND CCD Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. - 12 - CXA3741AUR Application Circuit 2 (when using CCD with internal current source) 470k IDRV1 GND 220k SFCNT IDRV0 1000pF 0.1F VCC 5 4 3 2 1 16 DRVCNT ISF0 6 Current Mirror Current Mirror 15 GND ISF1 7 14 OUT CDS/ADC NC 8 13 NC 15V GND 9 10 IN 11 GND 12 NC GND CCD Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. - 13 - CXA3741AUR Notes On Handling Provide the widest GND pattern possible on the board. Use a 1000pF (recommended) ceramic capacitor and a 0.1F (recommended) ceramic capacitor in parallel for the bypass capacitor connected between the power supply and GND, and connect them as close to the IC pins as possible. Load capacitance causes the input/output wiring response to worsen and results in noise. Use the short wiring layout, and shield it with GND. When the output pin (Pin 14) is shorted to either the power supply or GND, an overcurrent may flow to the IC and damage it. When the input pin (Pin 10) is shorted to GND, an overcurrent may flow to the internal parasitic elements and damage them. - 14 - CXA3741AUR Package Outline (Unit: mm) 16PIN UQFN (PLASTIC) x4 0.1 S 0.4 0.1 2.3 0.55 0.05 0.9 C 4-R0.2 A-B C 12 13 9 8 2.3 A B 16 1 4 5 0.4 0.18 PIN 1 INDEX 0.07 0.25 0.05 M S A-B C Thermal Die Pad 0.14 26 0. 0.05 S S MAX0.02 5-18m Solder Plating + 0.09 0.14 - 0.03 + 0.09 0.25 - 0.03 S TERMINAL SECTION Note:Cutting burr of lead are 0.05mm MAX. SONY CODE EIAJ CODE JEDEC CODE UQFN-16P-01 PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.01g LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% - 15 - Sony Corporation |
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